Heterogeneous Wafer-Scale Circuit Architectures
نویسندگان
چکیده
منابع مشابه
Three Dimensional Integration and On-wafer Packaging for Heterogeneous Wafer-scale Circuit Architectures
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ژورنال
عنوان ژورنال: IEEE Microwave Magazine
سال: 2007
ISSN: 1527-3342
DOI: 10.1109/mmw.2007.316255